The surface of copper gets tarnished by the formation of copper oxide. $N_2$ gas was passed to prevent the oxide formation during heating of copper at $1250 \ K$. However,the $N_2$ gas contains $1 \ \text{mole}\%$ of water vapour as impurity. The water vapour oxidises copper as per the reaction given below:
$2 Cu_{(s)} + H_2O_{(g)} \longrightarrow Cu_2O_{(s)} + H_{2(g)}$
$p_{H_2}$ is the minimum partial pressure of $H_2$ (in $\text{bar}$) needed to prevent the oxidation at $1250 \ K$. The value of $\ln(p_{H_2})$ is . . . . .
(Given: total pressure $= 1 \ \text{bar}$,$R = 8 \ J \ K^{-1} \ mol^{-1}$,$\ln(10) = 2.3$. $Cu_{(s)}$ and $Cu_2O_{(s)}$ are mutually immiscible.
At $1250 \ K$: $2 Cu_{(s)} + 1/2 O_{2(g)} \longrightarrow Cu_2O_{(s)}; \Delta G^\theta = -78,000 \ J \ mol^{-1}$
$H_{2(g)} + 1/2 O_{2(g)} \longrightarrow H_2O_{(g)}; \Delta G^\theta = -1,78,000 \ J \ mol^{-1}$)

• A
  $-13.60$
• B
  $-14.50$
• C
  $-14.60$
• D
  $-14.70$