For silver plating of copper,$K[Ag(CN)_2]$ is used instead of $AgNO_3$. This is because ........

  • A
    $A$ thin layer of $Ag$ is formed on $Cu$.
  • B
    Higher voltage is required.
  • C
    $Ag^+$ ions are completely removed from the solution.
  • D
    Due to the low availability of $Ag^+$ ions,$Cu$ cannot displace $Ag$ from the $[Ag(CN)_2]^-$ ion.

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